Thank you for taking an interest in the military and defense parts, aerospace parts, and other NSN part offerings we offer here on ASAP Rotable Parts. You have reached the request for quote (RFQ) page for Sgs Thompson Microelectronics Inc part number DEL1403N-70LM, a Microcircuit Memory item that is listed alongside the NSN 5962012485010 for an ease of identification. If you would like to receive more information on this part alongside purchasing options, please fill out and submit the form provided on this page at your earliest convenience. When you provide us with details like your target price, expected shipping time frame, and more, we can best formulate and present a quote on part number DEL1403N-70LM that caters to you.
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To ensure an ease of part identification and procurement, we list all offerings with as much information as we can. For example, part number DEL1403N-70LM is specifically produced under CAGE Code 60911, that of which identifies the specific facility where this traces back to. Additionally, with the first digits of NSN 5962-01-248-5010, one can determine that this item belongs to FSC 5962 Microcircuits Electronic. With such information, you can always rest assured that you are procuring exactly what you require. As such, get started on the quotation process today, and see why so many customers steadily choose us for fulfillment.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-248-5010 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 012485010 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| IDT6167L70LB | 2 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.425 INCHES NOMINAL |
| ADAT | BODY WIDTH | 0.290 INCHES NOMINAL |
| ADAU | BODY HEIGHT | 0.085 INCHES NOMINAL |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND HIGH RELIABILITY AND MONOLITHIC |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 17 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
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